ADI晶圆化合物半导体材料
发布时间:2021-03-18 17:13:47 浏览:1568
ADI晶圆的制取包括衬底制取和外延性工艺。衬底是由半导体材料单晶材料制作而成的晶片。该基板可直接进入晶圆制造流程以生产制造半导体元器件或外延性晶圆。外延性是指在单晶衬底上生长一层新单晶的流程。ADI新的单晶能够是与衬底相同的材料,还可以是有所不同的材料。外延性能够产生越来越多种类的材料,使元器件设计有越来越多的选择。
衬底制取的基础步骤如下:首先,对半导体材料多晶材料进行提炼、掺杂和拉伸,获得单晶材料。以硅为例子,先将硅砂精炼、复原为纯度98%左右的冶金工业级粗硅,再通过多次提炼,获得电子级高纯度多晶硅,再经炉拉获得单晶硅棒。通过机械加工、化学处理、表面抛光和质量检测,获得了满足一定标准的单晶抛光片。抛光的目的是更进一步去除加工表面上的残余损伤层。综上所述抛光片可直接适用于制造元器件,也可用作外延性的衬底材料。
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Generic | Material | Description | Order Qty | Package Option | Category |
ADA4841-2 | ADA4841-2KGD-WP | Dual Low Power Low Noise Rail-Rail OpAmp | Contact ADI | WAFFLEPACK | Amplifiers |
ADA4870 | ADA4870-KGD-WP | Single Channel High Speed, 1A Output | Contact ADI | WAFFLEPACK | Amplifiers |
ADA4870 | ADA4870-KGD-DF | Single Channel High Speed, 1A Output | Contact ADI | FILMFRAME | Amplifiers |
ADN2820 | ADN2820ACHIPS | 10Gbps Tranimpedance Amplifier | Contact ADI | WAFFLEPACK | Amplifiers |
ADN2880 | ADN2880ACHIPS | 2.7Gbps Transimpedance Amplifier IC. | Contact ADI | WAFFLEPACK | Amplifiers |
OP27 | OP27NBC | 9/30V, BIP, OP, Low Noise, Low Dr | Contact ADI | WAFFLEPACK | Amplifiers |
OP284 | OP284CHIPS | 3/30V, BIP, OP, Low Noise, RRIO, 2X | Contact ADI | WAFFLEPACK | Amplifiers |
OP37 | OP37NBC | 9/30V, BIP, OP, Low Noise, Avo >-5, 1X | Contact ADI | WAFFLEPACK | Amplifiers |
OP37 | OP37-001C | 9/30V, BIP, OP, Low Noise, Avo >-5, 1X | Contact ADI | FILMFRAME | Amplifiers |
OP400 | OP400GBC | 6/30V, BIP, OP, Low Vos, Low Isy, 4X | Contact ADI | WAFFLEPACK | Amplifiers |
OP42 | OP42NBC | Fast Settling Precision op amp | Contact ADI | WAFFLEPACK | Amplifiers |
OP467 | OP467GBC | Quad Precision, High Speed Op Amp | Contact ADI | WAFFLEPACK | Amplifiers |
OP77 | OP77NBC | 6/30V, BIP, OP, Low Vos, Precision, 1X | Contact ADI | WAFFLEPACK | Amplifiers |
OP77 | OP77-001C | 6/30V, BIP, OP, Low Vos, Precision, 1X | Contact ADI | FILMFRAME | Amplifiers |
HMC-ALH102G | HMC-ALH102 | GaAs HEMT WBand lo Noise amp, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH102G | HMC-ALH102-SX | GaAs HEMT WBand lo Noise amp, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH482G | HMC-ALH482 | GaAs HEMT WBand lo Noise amp, 2 - 22 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH482G | HMC-ALH482-SX | GaAs HEMT WBand lo Noise amp, 2 - 22 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH232G | HMC-AUH232 | GaAs HEMT WBand Driver amp, DC - 43 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH249G | HMC-AUH249 | GaAs HEMT WBand Driver amp, DC - 35 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH312G | HMC-AUH312 | GaAs HEMT WBand Driver amp, DC - 65 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC460G | HMC460 | WBand lo Noise amp Chip, DC - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC460G | HMC460-SX | amp, lo Noise, DC-20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC462G | HMC462 | low Noise amp Chip, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC462G | HMC462-SX | I.C., 2-20 GHz WBand LNA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC463G | HMC463 | low Noise amp Chip w/AGC, 2-20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC463G | HMC463-SX | I.C., 2-20GHz LNA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC465G | HMC465 | WBand Driver amp Chip, DC - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC465G | HMC465-SX | I.C., DC-20GHz PA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC562G | HMC562 | WBand Driver amp Chip, 2 - 35 GHz | Contact ADI | GEL_PACK | Amplifiers |
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